“More-than-Moore” White Paper

Editors:

Wolfgang Arden

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Michel Brillouët

Patrick Cogez

Mart Graef

Bert Huizing

Reinhard Mahnkopf

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Scaling: More than Moore’s law

Andrew B. Kahng

University of California, San Diego

THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS 2.0: 2015

LINK TO ITRS 2.0, 2015 FULL EDITION DETAILS

2.0

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INTERNATIONAL

TECHNOLOGY ROADMAP

FOR

SEMICONDUCTORS 2.0

2015 EDITION

EXECUTIVE REPORT

THE ITRS 2.0 IS DEVISED AND INTENDED FOR TECHNOLOGY ASSESSMENT ONLY AND IS WITHOUT REGARD TO

ANY COMMERCIAL CONSIDERATIONS PERTAINING TO INDIVIDUAL PRODUCTS OR EQUIPMENT.

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Cramming more components onto integrated circuits

With unit cost falling as the number of components per circuit rises, by 1975 economics may dictate squeezing as many as 65,000 components on a single silicon chip

By Gordon E. Moore

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Director, Research and Development Laboratories, Fairchild Semiconductor

division of Fairchild Camera and Instrument Corp.

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More than Moore or More Moore: a SWOT analysis*

G. Dan Hutcheson# with Herbert S. Bennett+,++

#VLSIresearch, 2880 Lakeside Drive, Suite 350, Santa Clara, CA 95054 USA

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and

+National Institute of Standards and Technology, Gaithersburg, Maryland 20899 USA

* Copyright © 2011 by VLSI RESEARCH INC. All rights reserved. Reprinted with permission from VLSI RESEARCH INC.

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