FOR IMMEDIATE RELEASE BUREAU OF INDUSTRY AND SECURITY

October 17, 2023 Office of Congressional and Public Affairs

https://bis.doc.gov Media Contact: OCPA@bis.doc.gov

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Commerce Strengthens Restrictions on Advanced Computing Semiconductors, Semiconductor Manufacturing Equipment, and Supercomputing Items to Countries of Concern

Updates to Modify and Reinforce Restrictions Initially Released on October 7, 2022, to Address National Security Concerns Posed by PRC Military Modernization

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国产AI芯片的创业裂变

2023年05月26日 中邮证券 孙业亮,丁子惠,常雨婷

A STRATEGY FOR THE CHIPS FOR AMERICA FUND

CHIPS for AMERICA

TABLE OF CONTENTS

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INTRODUCTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Statutory Background. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Industry and Stakeholder Input. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

PART I: GUIDING PRINCIPLES. 5

PART II. BACKGROUND ON THE U.S. SEMICONDUCTOR INDUSTRY . . . . . . . . . . . . . . . . . . . . . . . . . . 6

PART III. IMPLEMENTING THE CHIPS PROGRAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Organization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Eligibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Key Initiatives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

PART IV: CONSIDERATIONS FOR APPLICANTS FOR CHIPS INCENTIVES. . . . . . . . . . . . . . . . . . . . . . 14

CONCLUSION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

ENDNOTES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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Incentives, Infrastructure, and Research and Development Needs to Support a Strong Domestic Semiconductor Industry

NIST Special Publication

NIST SP 1282

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Summary of Responses to Request for Information

This publication is available free of charge from:

https://doi.org/10.6028/NIST.SP.1282

August 2022

U.S. Department of Commerce

Gina M. Raimondo, Secretary

National Institute of Standards and Technology

Laurie E. Locascio, NIST Director and Under Secretary of Commerce for Standards and Technology

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2022年3月25日

XR（VR/AR/MR）产业链梳理

——从智能手机到XR，从移动互联网到元宇宙

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研究助理：刘睿哲

执业编号：S0600121070038

邮箱：liurz@dwzq.com.cn

证券分析师 ：张良卫

执业证书编号：S0600516070001

联系邮箱：zhanglw@dwzq.com.cn

证券研究报告·行业研究·半导体

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行业研究类模板

深度报告

半导体行业报告日期：2022 年8 月7 日

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CHIPLET：延续摩尔定律—先进制程替代之路！

──行业深度报告

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The U.S.-Japan Semiconductor Agreement- Keeping Up the Managed Trade Agenda

S.3933 - CHIPS for America Act

Introduced in Senate (06/10/2020)

Creating Helpful Incentives to Produce Semiconductors for America Act or the CHIPS for America Act

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This bill establishes investments and incentives to support U.S. semiconductor manufacturing, research and development, and supply chain security.

Specifically, the bill provides an income tax credit for semiconductor equipment or manufacturing facility investment through 2026. The bill also establishes a trust fund to be allocated upon reaching an agreement with foreign government partners to promote (1) consistency in policies related to microelectronics, (2) transparency in microelectronic supply chains, and (3) alignment in policies towards nonmarket economies.

The Department of Commerce shall, through the National Institute of Standards and Technology (NIST), carry out a program of research and development investment to accelerate the design, development, and manufacturability of next generation microelectronics, including through the creation of a Manufacturing USA institute for semiconductor manufacturing. Commerce shall also establish a program to match state and local government incentives offered to private entities for the purposes of building fabrication facilities relating to semiconductor manufacturing. Further, Commerce shall assess the capabilities of the U.S. industrial base to support the national defense in light of the global nature of supply chains and interdependencies between the industrial bases of the U.S. and foreign countries with respect to the manufacture and design of semiconductors.

The Department of Defense shall prioritize the use of specified available amounts for programs, projects, and activities in connection with semiconductor and related technologies.

The President shall establish within NIST a subcommittee on matters relating to U.S. leadership in semiconductor technology and innovation, which shall develop a national strategy on semiconductor research.

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