A STRATEGY FOR THE CHIPS FOR AMERICA FUND

CHIPS for AMERICA

TABLE OF CONTENTS

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INTRODUCTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Statutory Background. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Industry and Stakeholder Input. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

PART I: GUIDING PRINCIPLES. 5

PART II. BACKGROUND ON THE U.S. SEMICONDUCTOR INDUSTRY . . . . . . . . . . . . . . . . . . . . . . . . . . 6

PART III. IMPLEMENTING THE CHIPS PROGRAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Organization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Eligibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Key Initiatives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

PART IV: CONSIDERATIONS FOR APPLICANTS FOR CHIPS INCENTIVES. . . . . . . . . . . . . . . . . . . . . . 14

CONCLUSION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

ENDNOTES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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Incentives, Infrastructure, and Research and Development Needs to Support a Strong Domestic Semiconductor Industry

NIST Special Publication

NIST SP 1282

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Summary of Responses to Request for Information

This publication is available free of charge from:

https://doi.org/10.6028/NIST.SP.1282

August 2022

U.S. Department of Commerce

Gina M. Raimondo, Secretary

National Institute of Standards and Technology

Laurie E. Locascio, NIST Director and Under Secretary of Commerce for Standards and Technology

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Strategic Opportunities for U.S. Semiconductor Manufacturing

The U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) has released a report outlining seven strategic “grand challenges” in measurement, standardization, and modeling and simulation that, if met, will strengthen the U.S. semiconductor industry.

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美国商务部国家标准与技术研究所（NIST）发布了一份报告，概述了在测量、标准化、建模和仿真方面的七大战略性"重大挑战",如果这些挑战得到满足，将加强美国半导体产业。

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NISTIR 7749

Model Based Enterprise

Technical Data Package Requirements

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Simon Frechette

Paul Huang

Mark Carlisle

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Proceedings of the 10th Model-Based Enterprise Summit (MBE 2019)

PublishedJuly 2, 2019

Author(s)

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Thomas D. Hedberg Jr., Mark G. Carlisle

Abstract

The National Institute of Standards and Technology (NIST) hosted the tenth installment of the Model-Based Enterprise Summit (MBE 2019) on April 2-4, 2019 in Gaithersburg, Maryland. The MBE Summit grew 114 percent over the past five MBE Summits. This continues speaks to the growing interest of MBE within the community and the importance of the Summit output. The goal of the MBE Summit is to identify challenges, research, implementation issues, and lessons learned in design, manufacturing, quality assurance, and sustainment of products and processes where a digital three-dimensional (3D) model of the product serves as the authoritative information source for all activities in a product's lifecycle. The theme of MBE 2019 was "Democratizing the Implementation of MBE". The model-based community moved beyond the question of "why is MBE important?" to "how do we deploy MBE?". The tenth MBE Summit was focused on highlighting the long history of MBE and real-world implementations of MBE in practice. Academia, government, and industry practitioners submitted papers on topics related to this year's theme using the following tracks: 1) Systems Engineering and Lifecycle Management; 2) Design; 3) Manufacturing; 4) Quality and Inspection; and 5) Operations, Logistics, and Sustainment. This volume contains the papers presented at MBE 2019. There were 58 submissions. Each submission was reviewed by experts and decided upon by the program committee. The committee decided to accept 30 papers. The MBE 2019 program also included five invited talks and three panels.

CitationAdvanced Manufacturing Series (NIST AMS) - 100-24

Report Number100-24

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Proceedings of the 9th Model-Based Enterprise Summit (MBE 2018)

PublishedMay 1, 2019

Author(s)

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Thomas D. Hedberg, Mark G. Carlisle

Abstract

The ninth installment of the Model-Based Enterprise (MBE) Summit was hosted at the National Institute of Standards and Technology (NIST) on April 2-5, 2018. The MBE Summit 2018 witnessed another year-over-year registration growth. This speaks to the growing interest of MBE within the community and the importance of the Summit output. The MBE Summit 2018 Program Committee undertook a significant effort to ensure a high-quality summit and signal to the community that the MBE Summit is the best place for gathering and sharing information dedicated to the digital transformation across the product lifecycle. The MBE Summit 2018 focused on empowering the industrial shift to MBE with recommended practices and how-to guidance. The MBE Summit 2018 theme was Empowering the Digital Transformation with an Integrated Lifecycle, with technical tracks spanning across Systems Engineering and Lifecycle Management, Design Recommended Practice and Model-Based Definition, Model-Based Manufacturing, and Model-Based Quality and Inspection. The MBE Summit had 70 submissions for presentation, of which the Program Committee accepted eight papers, 33 presentations, five posters, and two panels. This report is the proceedings of the MBE Summit 2018.

CitationAdvanced Manufacturing Series (NIST AMS) - 100-22

Report Number100-22

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Proceedings of the 11th Model-Based Enterprise Summit (MBE 2020)

PublishedApril 30, 2020

Author(s)

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Thomas D. Hedberg Jr., Mark G. Carlisle

Abstract

The National Institute of Standards and Technology (NIST) hosted the eleventh installment of the Model-Based Enterprise Summit (MBE 2020) on March 31 through April 2, 2020 in Gaithersburg, Maryland. The MBE 2020 witnessed another year-over-year registration and attendance growth. The MBE Summit saw hundreds of attendees gather over three days to share their experiences with Model-Based Enterprise (MBE). This speaks to the continued growing interest of MBE within the community and the importance of the Summit output. The goal of the MBE Summit is to identify challenges, research, implementation issues, and lessons learned in design, manufacturing, quality assurance, and sustainment of products and processes where a digital three-dimensional (3D) model of the product serves as the authoritative information source for all activities in a product's lifecycle. The theme of MBE 2020 was "Increasing MBE Adoption and Implementation." There is no doubt that MBE requires a complex organizational work design that recognizes the interaction between people, skills, and technology in workplaces. The 11th MBE Summit is focused on highlighting the organizational culture surrounding MBE, needs of people operating in MBE, and real-world implementations of MBE in practice. Authors from academia, government, and industry submitted papers on topics related to this year's theme using the following tracks: 1) Business Processes; 2) Organization Culture; 3) Technology; and 4) Workforce Skills. This volume contains the papers presented at MBE 2020. The MBE 2020 program included four invited talks, five tutorials, five panels, and 25 papers. In addition, the MBE 2020 program included a vendor-demonstration track where solution providers and vendors demonstrated MBE offerings.

CitationAdvanced Manufacturing Series (NIST AMS) - 100-29

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Current Activities Related to the Core Manufacturing Simulation Data Standards Development Effort

Current Activities Related to the Core Manufacturing Simulation Data Standards Development Effort

PublishedAugust 7, 2008

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Author(s)

Yung-Tsun T. Lee, Frank H. Riddick, Charles R. McLean, Swee K. Leong

Abstract

The Core Manufacturing Simulation Data (CMSD) specification, developed by researchers at the National Institute of Standards and Technology, provides neutral structures for the efficient exchange of manufacturing data in a simulation environment. The CMSD effort is being developed under the guidelines, policies, and procedures of the Simulation Interoperability Standards Organization (SISO) to address interoperability issues affecting simulation systems and other manufacturing applications. This paper describes some of the activities related to the CMSD standards development effort, including comparison of CMSD to other specifications in the domain, pilot implementations of the CMSD specification at automotive assembly plant, and the simulation of inventory systems in a generic automotive assembly simulation.

Proceedings TitleProceedings of the Fall 2008 Simulation Interoperability Workshop

Conference DatesSeptember 14-19, 2008

Conference LocationOrlando, FL

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