中电 SMT 行业云平台及应用实践

中电工业互联网有限公司

王斌 SMT 事业部总监

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2020年7月

行业背景与痛点

平台定位与功能

平台运营模式

平台效益

成果与前景

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Building Electronics with Surface Mount Technology

James Jefferson Jarvis KB0THN

APRS World, LLC

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jj@aprsworld.net

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Surface-mount technology

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In industry, it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technology used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.

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By employing SMT, the production process speeds up, but the risk of defects also increase due to component miniaturization and to the denser packing of boards. In those conditions, detection of failures has become critical for any SMT manufacturing process.

An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.

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