Tymon Barwicz et al. © 2017 IBM Corporation

High-Throughput Photonic Packaging

March, 2017

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High-Throughput Photonic Packaging

T. Barwicz, T. W. Lichoulas, Y. Taira,Y. Martin, S. Takenobu, A. Janta-Polczynski, H. Numata, E. L. Kimbrell, J.-W. Nah, B. Peng, R. Leidy, M. Khater, S. Kamlapurkar, S. Engelmann, P. Fortier, N. Boyer

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